Verified Supplier | Shanghai Transunique...

Shanghai Transunique Technologies Co., Ltd.

China (Mainland) | Manufacturer, Trading Company | Contact Details
Established 2003
7 years OEM
Response Rate
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Quick Details

  • Other Names: Epoxy 353ND
  • Place of Origin: Massachusetts, United States
  • Classification: Double Components Adhesives
  • Main Raw Material: Epoxy
  • Usage: Fiber & Garment, Packing
  • Brand Name: EPO-TEK
  • Model Number: EPO-TEK 353ND
  • EPO-TEK 353ND: EPO-TEK Epoxy 353ND
  • Color: Part A: Clear (Gardner <5) Part B: Amber (Gardner <18)
  • Consistency: Pourable liquid
  • Viscosity (@ 50 RPM/23°C): 3000-5000 cps
  • Glass Transition Temp.(Tg): ≥ 90°C
  • Coefficient of Thermal Expansion (CTE): Below Tg: 54 x 10-6 in/in/°C Above Tg: 206 x 10-6 in/in/°C
  • Spectral Transmission: > 50% @ 550 nm; > 98% @ 800-1000 nm > 95% @ 1100 - 1600 nm

Packaging & Delivery

Packaging Details: standard carton package(EPO-TEK Epoxy 353ND)
Delivery Detail: despatched in 1 week against receiving the down payment


1.Sealing fiber into ferrules
2.Fiber component packaging
3.Adhesive for V-groove arrays

 EPO-TEK Epoxy 353ND


Two component heat curing epoxy adhesive, also known 353ND fiber bonding agent for the production of optical component, widely used in the production of fiber optic connectors.



Advantages & Application:



Reasonable pot-life that allows for low temperature curing to be realized. It has an amber color change upon cure.


 NASA approved, low outgassing epoxy


 Semiconductor suggested applications: wafer-wafer bonding of CSP; fabrication of MEMs devices; flip chip underfill.


 Hybrid suggested applications: providing near hermetic seals in sensor devices, resisting high temperature packaging


o Down-Hole petrochemical fiber optic sensors, resisting >200°C field conditions


 Fiber optic adhesive designed to meet Telecordia 1221 - suggested applications:


o Sealing fiber into ferrules, transmitting light in the optical pathway from 800- 1550 nm range


o Fiber component packaging; adhesive for active alignment of optics, environmental seal of opto-package, V-groove arrays


 Medical suggested applications:


o Potting Fiber Optic bundles into SST ferrules for light guides and endoscopes, resisting sterilization cycles of autoclave, ETO, gamma, H202 plasma.


o Certified to USP Class VI Biocompatiblility Standards for medical implants; adhesive for catheter devices including stents and guide wires


 Electronics Assembly suggested applications:


o Used as dielectric layer in the fabrication of capacitors; laminating PZT ferroelectrics found in ultrasound or ink-jetting devices


o Impregnating and insulating copper coil windings in motors and inductor coils. Bonding ferrite cores and magnets.


o Structural grade epoxy found in Hard-Disk drive devices; bonding of SST metals, kapton, and magnets








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